Forum: Reliability & Maintainability Questions and Answers
Posted by: Jorge Chong (email@example.com )
Organization:Matsushita Electronic Components
Date posted: Mon May 8 14:41:12 US/Eastern 2000
Subject: LOOKING FOR INFORMATION
Need information about document/standard UAT-0467 (USER ACCEPTANCE TEST, if I'm not mistakeing). I appreciate any info. that may relate to this document. Thank you
Posted by: Laurent Purrey (LPurrey@zodiac-group.com )
Date posted: Tue May 2 2:25:38 US/Eastern 2000
Subject: MTBF & Failure Modes
I'm working on a FMECA and I have a problem to find some reliability data on a component: a fire protection. This fire protection overlaps a rubber part and protect it against oil leakage coming from a turbopropeller engine. In fact, the fire protection is a specific foam which is expandable with the heat.
I don't find an equivalence within the NPRD-95 and FMD-97 respectively for the MTBF value and the associated Failure Modes. It would be helpful if you could give some sources or data regarding this application. Thank you for your help.
Posted by: Sing Tay (firstname.lastname@example.org )
Date posted: Tue Apr 18 19:35:39 US/Eastern 2000
Subject: FIT rates, Temp and voltage acceleration factors in semiconductor devices
I just recently joined reliability engineering in this company and there have been discussions going on in trying to reduce BI or going to no-BI on some devices. I just want to find out from anybody out there who knows more about Temp and Voltage acceleration factors, how activation energies and beta values affect Temp and Voltage acceleration respectively. A more specific question would be do other companies set a generalized activation energy across all technology within the company or work is done to characterize the beta and Ea for each technology.
Also, does anybody know how to design experiments to calculate these two parameters, or maybe can provide guidance to certain papers or books? Any feedback will be greatly appreciated. Please send an email to email@example.com Thanks!
Posted by: XiangPing,Wu (firstname.lastname@example.org )
Date posted: Sun Apr 16 22:49:34 US/Eastern 2000
I have bought a book of Worst Case Circuit Analysis Application Guidelines from RAC. I wonder where the figure 13 on page 71 and figure 14 on page 72 are from? Are they provided by the device vendor?
Posted by: Eduard Porst (email@example.com )
Date posted: Fri Apr 14 10:41:27 US/Eastern 2000
Subject: Quality factor for microcircuits
What is the equivalent MIL-HDBK-217F quality level (PiQ =0.25 or PiQ=1) for a microcircuit purchased to a Standard Military Drawing, device class V (for space applications) ?