Forum: Reliability & Maintainability Questions and Answers

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Posted by: Jorge Chong (chongj@acomsd-bc.panasonic.com )
Organization:Matsushita Electronic Components
Date posted: Mon May 8 14:41:12 US/Eastern 2000
Subject: LOOKING FOR INFORMATION
Message:
Hello.....
Need information about document/standard UAT-0467 (USER ACCEPTANCE TEST, if I'm not mistakeing). I appreciate any info. that may relate to this document. Thank you

Replies:
Parts Count Reliability Prediction
Jack Farrell Tue May 9 8:54:30 US/Eastern 2000

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Posted by: Laurent Purrey (LPurrey@zodiac-group.com )
Organization:AERAZUR-ZODIAC GROUP
Date posted: Tue May 2 2:25:38 US/Eastern 2000
Subject: MTBF & Failure Modes
Message:
I'm working on a FMECA and I have a problem to find some reliability data on a component: a fire protection. This fire protection overlaps a rubber part and protect it against oil leakage coming from a turbopropeller engine. In fact, the fire protection is a specific foam which is expandable with the heat.
I don't find an equivalence within the NPRD-95 and FMD-97 respectively for the MTBF value and the associated Failure Modes. It would be helpful if you could give some sources or data regarding this application. Thank you for your help.

Replies: (list all replies)
Fire Protection Device
Jack Farrell Thu May 4 14:52:17 US/Eastern 2000
MTBF
Cloarec Thu Jul 27 5:14:44 US/Eastern 2000

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Posted by: Sing Tay (stay@idt.com )
Organization:IDT
Date posted: Tue Apr 18 19:35:39 US/Eastern 2000
Subject: FIT rates, Temp and voltage acceleration factors in semiconductor devices
Message:
I just recently joined reliability engineering in this company and there have been discussions going on in trying to reduce BI or going to no-BI on some devices. I just want to find out from anybody out there who knows more about Temp and Voltage acceleration factors, how activation energies and beta values affect Temp and Voltage acceleration respectively. A more specific question would be do other companies set a generalized activation energy across all technology within the company or work is done to characterize the beta and Ea for each technology.
Also, does anybody know how to design experiments to calculate these two parameters, or maybe can provide guidance to certain papers or books? Any feedback will be greatly appreciated. Please send an email to stay@idt.com Thanks!

Replies:
Burn-in, Accelerated Testing
Jack Farrell Wed Apr 19 15:27:34 US/Eastern 2000

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Posted by: XiangPing,Wu (7815@notesmail.huawei.com.cn )
Organization:HUAWEI.TECH.CO.,LTD
Date posted: Sun Apr 16 22:49:34 US/Eastern 2000
Subject: WCCA
Message:
I have bought a book of Worst Case Circuit Analysis Application Guidelines from RAC. I wonder where the figure 13 on page 71 and figure 14 on page 72 are from? Are they provided by the device vendor?

Replies:
WCCA Data Sources
Jack Farrell Mon Apr 17 8:28:06 US/Eastern 2000

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Posted by: Eduard Porst (porst@teldix.de )
Organization:TELDIX GmbH
Date posted: Fri Apr 14 10:41:27 US/Eastern 2000
Subject: Quality factor for microcircuits
Message:
What is the equivalent MIL-HDBK-217F quality level (PiQ =0.25 or PiQ=1) for a microcircuit purchased to a Standard Military Drawing, device class V (for space applications) ?

Replies:
PiQ factor for class V microcircuit
Jack Farrell Tue Apr 18 10:28:32 US/Eastern 2000

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