Forum: Reliability & Maintainability Questions and Answers
Posted by: Quek Puay Keng (qpuayken@dso.org.sg ) Organization:DSO National Laboratories Date posted: Mon Jan 31 21:44:40 US/Eastern 2000 Subject: Reliability of Flexible PCB Message: Thermal shock test was performed on a batch of flexible PCBs. After the test, waviness was observed at the PCB edges and at areas where there is no copper. Circuit continuity was maintained. However, will the waviness pose a long term reliability problem? Is it a sign of delamination? Appreciate advice/comments. Thank you and regards.
Posted by: Xiangping,Wu (wuxiangping@huawei.com.cn ) Organization:HUAWEI TECH.LTD.P.R.C Date posted: Sat Jan 29 2:13:33 US/Eastern 2000 Subject: AT&T RELIABILITY HANDBOOK Message: I'm looking for a reliability handbook,it was published by AT&T.The author's name is Dª±Jª±Klinger, Y.Nakada,M.Menendez.Anybody can tell me where I can buy this book.Thanks.
Posted by: Xiangping,Wu (wuxiangping@huawei.com.cn ) Organization:Huawei.Tech.Ltd.P.R.C Date posted: Fri Jan 28 6:06:58 US/Eastern 2000 Subject: Number of reliability engineers Message: There're about 10'000 employees in our company,and about 3000 develop engineers among them.Any one can tell me how many reliability engineers we should have.
Posted by: Ten Lin Mei (tlinmei@dso.org.sg ) Organization:DSO National Laboratories Date posted: Wed Jan 26 23:54:28 US/Eastern 2000 Subject: FMECA from Card/Module Level Message: I wish to reduce the time in performing FMECA and TA for a large system by starting the FMECA from card and module levels (instead of component level). However, if I adopt this method, inaccuracies will come in when estimating the failure mode apportionments. I can estimate the failure mode apportionment by tracing back the component failure modes that cause the particular card/module failure mode. But this may end up consuming equally long or longer time than the component approach. Is there any reference or standard library on typical card/module failure modes and failure mode apportionment rates ? Or is there any recommendation on a good estimation method ? Also, is there any suggestion on how to verify or validate that this card/module level approach has not lost out a lot in the accuracies compared to the component level approach ? By the way, how do people estimate failure mode apportionments in the functional approach of FMECA ? Tracing back the components that are failure causes ? Thank you.
Posted by: Adon Looi (looiadon@ses.st.com.sg ) Organization:Singapore Engineering Software Date posted: Wed Jan 26 20:23:41 US/Eastern 2000 Subject: Reliability Prediction on different environment Message: Hi, I need some advise on the reliability prediction. If I uses the MTBF predicted for Ground Fixed environment in Ground Mobile environment, that means that I have to degrade the MTBF by a factor of 0.2 as refered in the Reliability Toolkit for Commerical Practices. However, as the equipment will be ruggedised and isolator and shock pad are included to minimise the vibration and shock level, does that means that the factor of 0.2 does not stand anymore and I can asssume that the MTBF of GF is more or less equivalent to GM.
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