Forum: Reliability & Maintainability Questions and Answers
Posted by:Uma (http://painted-desert.hotmail.ru/ ) Organization:http://painted-desert.hotmail.ru/ Date posted: Fri May 13 15:15:12 US/Eastern 2005 Subject: reliability of CCD sensor Message: Hi, Does anybody have a failure rate for a CCD Linear Image Sensor? If not, does anybody know of a way of estimating the MTBF of a CCD (charge coupled device)? Thanks for all the responses.
Posted by:Senthil Kumar. R (rskr@ucalfuel.co.in ) Organization:UCAL Fuel Systems LImited Date posted: Wed May 11 1:16:15 US/Eastern 2005 Subject: HALT Reference Books Message: Please suggest me some ref / text books (which will be available in india), on HALT
Posted by: Farid Hady (fhsizwoyo@yahoo.com ) Date posted: Mon May 9 14:31:02 US/Eastern 2005 Subject: Chi Square Message: Question: question for your web I'm student of university in Indonesia, my name is Farid Hady, I'm doing thesis about chi squared test for goodness of fit, and I have a problem about how the data is binned, Which references do you use to make binned of data in example (normality test) that written on your web (The Chi Square : A large-Sample Godness of Fit Test, volume 10, No. 4)? thanks for your attention
Posted by: Jean-Marie Cloarec (jmcloarec@thsrc.com.tw ) Organization:IREG Date posted: Fri May 6 23:04:29 US/Eastern 2005 Subject: Temperature Influence on Reliability Message: I'm searching information about the influence of temperature on reliability. My concern is : reliability prediction take into account temperature influence, OK. But if electronic devices are under dormant condition without ventilation during a long time (say several months) then inside temperature will raise and will damage the device. Is there any analysis or recommendations on this subject ? Thanks
Posted by:Sadat (sadath@nortel.com ) Organization:nortel Date posted: Wed Apr 27 15:51:13 US/Eastern 2005 Subject: Tin Whiskers Message: Is anybody here plugged into the Tin Whisker discussions going-on on the RoHS initiative? Pure tin used in solder joints grows whiskers over time and eventually cause shorts between adjacent pins? Based on the type of package it look possible to predict the failure rate due to tin whiskers for a particular package type. Is it possible to use this info to look at the MTBF of a circuit pack and determine the risk of failure?
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