Forum: Reliability & Maintainability Questions and Answers
Posted by: Charles Schornak (firstname.lastname@example.org )
Organization:The Boeing Company
Date posted: Tue Feb 2 17:49:51 US/Eastern 1999
Subject: MIL-HDBK-217 Prediction Models
The front section 4 of MIL-HDBK-217 identifies the limitations of the reliability prediction models: "... none of the models in this handbook predict nuclear survivability or the effects of ionizing radiation." I am interested in any information pertaining to prediction models for resistors, capacitors, and diodes that are used in an ionized gas environment created by nucleating particles.
Posted by: Don Lin (email@example.com )
Date posted: Wed Jan 27 9:26:07 US/Eastern 1999
Subject: Survey of companies doing TAAF
Criscimagna and Zsak wrote an article "Reliability Growth" in the "Jour of RAC" (3rd Quarter 1998). It is similar to the use of the Test-Analysis-And-Fix (TAAF)approach (http://www.bmpcoe.org/how-to/books/taaf/intro.html) to increase the reliability of products. This approach was adopted by Army, Navy, and Air Force.
Do you know any companies implementing this approach? Any companies use it for non-military, commercial products?
Posted by: XiaoBoJiang (firstname.lastname@example.org )
Date posted: Mon Jan 25 2:42:02 US/Eastern 1999
Subject: FPA Assembly
My work is related with reliability of focal plane arrays assembly. Do anyone know how to evaluate the reliability of the FPA assembly.
Posted by: Mark Urban (email@example.com )
Date posted: Thu Jan 21 13:57:05 US/Eastern 1999
Does burn in today buy you anything? We currently perform a static burn in with after burn test defects around 0.001%.
Dynamic burn in has been suggested. What about HALT testing on prototypes and eliminating burn in on production lots. Any input would be much appreciated. Thanks, Mark
Posted by: Bert Moore (firstname.lastname@example.org )
Date posted: Tue Jan 19 15:12:36 US/Eastern 1999
Subject: Nonelectronic Failure Rates
I'm looking for a very good source to obtain nonelectronic failure rates.