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Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum (src_forum@alionscience.com )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Original Message:

Posted by: Bob Valerius (robert_m_valerius@md.northgrum.com )
Organization:Northrop-Grumman Oceanic Systems
Date posted: Wed Mar 15 9:25:07 US/Eastern 2000
Subject: reliability of crimp vs. solder type connections
Message:
Does anyone have any data on the reliability of crimp vs. solder type connections that is NOT from 217F? Thanks in advance.


Reply:

Subject: Crimp and Solder Failure Data
Reply Posted by: Bruce Dudley (bdudley@alionscience.com )
Organization: Reliability Analysis Center
Date Posted: Mon Mar 20 15:42:17 US/Eastern 2000
Message:
In the non-electronic data handbook (NPRD-95), failure data for solder and crimp joints are included. Some of the information shows that solder failure rates for ground fixed conditions are: 0.009 fits based on 140 billion hours and crimp failure rates are: 0.06 fits based on 24 billion hours in ground benign conditions. At best, it looks like a 6 to 1 ratio which is a greater ratio that is shown in MIL-HDBK-217. The handbook ratio is approxmately 2 to 1 (0.07 fits solder and 0.12 fits crimp both at ground benign conditions).


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