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Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum ( )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Original Message:

Posted by: Allan Brown ( )
Organization:Guigne Technologies Ltd
Date posted: Wed Aug 30 12:27:10 US/Eastern 2000
Subject: Crimp connection reliability testing
We have developed a stud type crimp connection - basically a washer with a shaped arm to which we crimp a wire. The wire size is 22awg. We wish to do a pull test and a temp cycling test. What would be the appropriate parameters to base our tests on? thanks


Subject: Reliability Testing
Reply Posted by: Jack Farrell ( )
Organization: Reliability Analysis Center
Date Posted: Tue Sep 26 15:41:36 US/Eastern 2000
MIL-STD-810F "ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS" presents methods for qualifying devices for use in various environments. For your device I would recommend the sections on temperature cycling and vibration be consulted for test guidance. The levels to which your device is subjected would depend on its intended use environment. I am unfamiliar with pull-test requirements.

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