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Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum ( )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Posted by: Tom Thompson ( )
Organization:Eastman Kodak
Date posted: Mon Oct 1 8:57:21 US/Eastern 2001
Subject: ASIC Failure Rate Model
What was the data collectioin timeframe for the ASIC(5.3 VHSIC section specifically) failure rate model in 217F? What number and types of devices was data collected on (rough estimate) for the model?


Subject: VHSIC/VHSIC - like Reliability Models
Reply Posted by: Bruce Dudley (bdudley )
Organization: Reliavbility Analysis Center
Date Posted: Wed Oct 3 11:32:08 US/Eastern 2001
The MIL-HDBK-217 reliability model for the VHSIC/VHSIC-Like devices was documented in the technical report "RADC-TR-89-177, VHSIC/VHSIC- Like Reliability Prediction Modeling". The report was submitted in October 1989 and the data collected was from the 1984 to 1988 time period. The data and test performed were related to 1.25 micron feature size devices which were state of the art at this time period. The number of the device types tested was about 20 depending on how one counts them. These included various gate arrays, RAM/ROM memories and microprocessors. The total number of devices tested was about 1000 and the test times varied from a low of 100 hours to high of 5000 hours. All testing was performed at high stress levels to force failure modes. The equivalent test times for room temperature conditions were: Model Validation -- 6 million hours Miscellaneous -- 7 billion hours Contamination -- 5 million hours Metalization -- 1.3 million hours Oxide -- 0.2 million hours This report is available from the National Technical Information Services, Springfield , VA. Their telephone number is: 703-605-6000.

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