SRC Forum - Message Replies
Forum: Reliability & Maintainability Questions and Answers
Topic: Reliability & Maintainability Questions and Answers
Topic Posted by: Reliability & Maintainability Forum
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998
Posted by: Sheila Prather
Organization:Northrop Grumman Corporation
Date posted: Wed Oct 17 8:27:10 US/Eastern 2001
Subject: Butt Joints Re J-STD-001B
J-STD-001B disallows use of butt joints for Class 3 equipment but does not clarify allowed usage for product development phases. One would assume that this would be disallowed for production hardware, but is there any historical data which would support use of this technique for hardware built during a design and development(EMD) phase of a program?
Subject: Use of Butt Joints
Reply Posted by: David Dylis
Organization: Reliability Analysis Center (RAC)
Date Posted: Wed Oct 17 13:08:23 US/Eastern 2001
As you identify, J-STD-001B disallows the use of butt joints for Class 3 equipment and does not clarify allowed usage for product development phases. A review of J-STD-001C did not identify any change in this requirement. According to J-STD-001C, the use of butt joints are however, allowed in Class 1 (General Electronic) and Class 2 (Dedicated Service Electronic) products. I could not identify any historical data that would support the use of this technique for Class 3 hardware built during design and development phase of a program. It may be possible to use these types of devices during prototype development for a Class 3 product, however, I would be concerned in their use throughout all of design and development since the knowledge gained regarding processes and hardware may be used during production. Further these processes and hardware are refined and validated by test during the design and development process.