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Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum (src_forum@alionscience.com )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Original Message:

Posted by: Ricardo DiScioscia (ricardo.discioscia@honeywell.com )
Organization:Honeywell
Date posted: Fri Mar 15 14:46:38 US/Eastern 2002
Subject: RADC-TR-89-281 update?
Message:
Does anyone know where I find a copy of this document or an updated version of this document. What I am looking for is a physics of failure methodology and a way to relate it to a MTBF. Thanks


Reply:

Subject: Finite Element Analysis
Reply Posted by: B.Dudley (bdudley@alionscience.com )
Organization: RAC
Date Posted: Mon Mar 18 11:16:14 US/Eastern 2002
Message:
This report, RADC-TR-89-281, is an old Rome Laboratory in-house report for finite element analysis. This report shown how a finite element analysis is used to predict the mechanical response of an electronic assembly exposed to thermal and vibration environments. The results of these analyses were used to estimate surface mount solder interconnections and microwire plated through hole connections when exposed to severe thermal environments. This report should be available from NTIS (National Technical Information Service) phone 703-605-6000. The code is ADA216907.


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