SRC Forum - Message Replies


Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum (src_forum@alionscience.com )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

Back to message list Topics List About this forum
Original Message:

Posted by: Kevin Silke
Date posted: Tue Jul 22 20:06:48 US/Eastern 2003
Subject: Temperature Cycling
Message:
Is it appropriate to define a unit level non-operating temperature cycle test using JEDEC standard JESD22-A104? We're looking at test condition B (-55C to +125C) for 1000 cycles. Is this a component level standard? We want to define an appropriate unit level test to stress the interconnects of production hardware.


Reply:

Subject: Temperature Cycling
Reply Posted by: BWD (bdudley@alionscience.com )
Organization: RAC
Date Posted: Mon Jul 28 12:50:21 US/Eastern 2003
Message:
The test procedure that you have referenced, JEDEC JESD22-A104, is a test that was designed for integrated circuit qualification testing. This is a very high stress test used to determine the qualification capability of solid state devices. The test is not designed for unit testing, both the number of cycles [1000] and the temperature range [180 degrees C] are greater than most unit specifications. At the unit level, this testing could be destructive and is highly likely to reduce the effective life of the unit. Interconnect tests at the unit level should be designed to identify problems, not destroy the item. A test of reduced scope should be considered and the unit should be powered during the heat cycle to identify intermittent problems.


Back to message list Topics List About this forum
Reply to this message