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Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum (src_forum@alionscience.com )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Original Message:

Posted by: Bob Valerius (robert.valerius@ngc.com )
Organization:Northrop-Grumman Oceanic Systems
Date posted: Tue Aug 17 14:32:39 US/Eastern 2004
Subject: Failure rate of a copper trace on a circuit board
Message:
Hi. Does anyone have a failure rate for simply the copper trace on a circuit board. I was thinking of using sections 16 of MIL-HDBK-217F but I don't think they apply. Thanks! Bob Valerius


Reply:

Subject: Copper Trace Failure Rates
Reply Posted by: bwd (bdudley@alionscience.com )
Organization: RAC
Date Posted: Thu Aug 19 10:54:34 US/Eastern 2004
Message:
The RAC handbook NPRD-95 has failure rates for different components that could be substituted in your analysis. These components and failure rates are: Shunt connector - 4.2 fits ground benign Spiral wrap connector - 7.8 fits ground benign Strip connector - 99 fits ground benign Circuit board failure rates are usually determined using the interconnection model in MIL-HDBK-217 (section 16.2 & 16.2). This model considers the plated through holes, surface mount solder connection and the number of circuit planes as the primary failure drivers. Copper traces are not listed in the model as a failure driver.


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