Forum: Reliability & Maintainability Questions and Answers

Topic: Reliability & Maintainability Questions and Answers

Topic Posted by: Reliability & Maintainability Forum ( )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998

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Posted by: Sheila Prather ( )
Organization:Northrop Grumman Corporation
Date posted: Wed May 17 13:49:02 US/Eastern 2000
Subject: Derating of Industrial/Commercial ICs in Plastic Packages
I reviewed the recent "Reliability Toolkit: Commercial Practices Edition" and although Table 5.1.3-1 does not specifically state that the derating information provided pertains to hermetic/ceramic packages, I assume this to be true. In light of my assumption, would like your recommendations regarding the derating levels you feel appropriate for both silicon and GaAs MMIC ICs in plastic packages. Would like both the case and junctions temperature guidelines, as appropriate (but, at a minimum the junction temperature derating level). Thanks for your response.


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