Forum: Reliability & Maintainability Questions and Answers
Topic: Reliability & Maintainability Questions and AnswersTopic Posted by: Reliability & Maintainability Forum (firstname.lastname@example.org )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998
Original Message:Posted by: Terry McCrossan
Date posted: Mon Jul 5 17:24:19 US/Eastern 1999
Subject: Component Derating
Does anyone have any new quantifiable data on the use of component parameter derating (thermal, power etc). I am used to the usual "margin of ignorance" type arguments, package glass transition temperatures and the junction/channel type Arrhenius relationships (generally with assumed activation energies). However, is there any more recent quantifiable data available to convince a sceptical design engineer and to what extent is derating used?