Forum: Reliability & Maintainability Questions and Answers
Topic: Reliability & Maintainability Questions and AnswersTopic Posted by: Reliability & Maintainability Forum (firstname.lastname@example.org )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998
Original Message:Posted by: Joni Siipola
Date posted: Fri Jul 30 6:36:18 US/Eastern 1999
Subject: component derating
I noticed an interesting question and since the answers were not particularly helpful, I'd like to arise the question once more. "Does anyone have any new quantifiable data on the use of component parameter derating (thermal, power etc). I am used to the usual "margin of ignorance" type arguments, package glass transition temperatures and the junction/channel type Arrhenius relationships (generally with assumed activation energies). However, is there any more recent quantifiable data available to convince a sceptical design engineer and to what extent is derating used?" Thank you for your help!