Forum: Reliability & Maintainability Questions and Answers
Topic: Reliability & Maintainability Questions and AnswersTopic Posted by: Reliability & Maintainability Forum (firstname.lastname@example.org )
Organization: System Reliability Center
Date Posted: Mon Aug 31 12:47:36 US/Eastern 1998
Original Message:Posted by:Sadat (email@example.com )
Date posted: Wed Apr 27 15:51:13 US/Eastern 2005
Subject: Tin Whiskers
Is anybody here plugged into the Tin Whisker discussions going-on on the RoHS initiative? Pure tin used in solder joints grows whiskers over time and eventually cause shorts between adjacent pins? Based on the type of package it look possible to predict the failure rate due to tin whiskers for a particular package type. Is it possible to use this info to look at the MTBF of a circuit pack and determine the risk of failure?